Close Menu
Memory Layout Design

Memory Circuit and Layout Design Interview Question

Updated:87 Comments4 Mins Read

Memory Circuit and Layout Design

Memory Circuit and Layout Design
Memory Circuit and Layout Design

Please add Your Interview questions in the comment box, we will add to this post with Answers and it also will be useful for others, so please add your questions

What is the Finger Concept in CMOS Layout
Mobility Enhancement Technique
Dummy Device in Semiconductor Layout Design
Why Density is Maintained in Semiconductor Layout Design
Folding the Transistors
Injection of Minority Carriers
What is the Difference between HSSP & HDSP Memory Compilers?
Which type of current is flowing in the CMOS Inverter?
I have two cases: ( Case1: One metal has 2um width and 10um length, case2: Two metals are running partially with 1um width and 10um length for each of two) So from a layout perspective, which case is best and why?
Memory Butterfly Architecture
Memory Bank Architecture
Why PMOS is used in reading mux?
What is the worst corner for bit cell Write Operation and why?
What is the worst corner for bit cell Read Operation and why?
Why do You need Pre-charge in SRAM memory?
What is Column Mux in Memory
What is RAM?
Comparison Between SRAM and DRAM
Characteristics of DRAM
Metallization Layers in Semiconductor Chips: Aluminum vs. Copper
Optical Proximity Correction (OPC) in VLSI
Thermal Oxidation: Understanding the Formation and Processes
What are the inputs of LVS?
The Number of Metal Layers in Layout Design
Characteristics of SRAM
As a Design Engineer, how do you handle Process Variations in VLSI?
What is Different about Logic family
What is Substrate coupling in VLSI?
RC-triggered-based Electrostatic Discharge (ESD) protection
Why PMOS and NMOS are sized equally in Transmission Gates?
Why is the substrate in NMOS connected to Ground and in PMOS to VDD?
Importance of Clock Distribution Network in VLSI
Why not give the output of a circuit to one large inverter?
Why do we gradually increase the size of inverters in buffer design
Which transistor has higher gain, BJT or MOS and why?
What is Charge Sharing in CMOS
CMOS logic, give the various techniques you know to minimize Power Consumption.
How does the Resistance of the metal lines vary with increasing thickness and increasing length?
What are the limitations in increasing the power supply to reduce delay?
What happens to delay if we include a resistance at the output of a CMOS circuit?
What happens to delay if you increase load capacitance?
Explain the sizing of the inverter in CMOS
Metal Semiconductor ohmic Contact
Wet Etching vs. Dry Etching: A Comparative Analysis
Advantages of SRAM
What is Dynamic Power?
Advantages of DRAM
Metal Semiconductor Contact
What are VIAs in VLSI?
Difference between CPLD and FPGA
State the De Morgan’s Theorem
Disadvantages of SRAM
Disadvantages of DRAM
Speed Comparison Between SRAM and DRAM
Why SRAM is faster than DRAM
Explain the working of 6-T SRAM cell
SRAM vs DRAM
Thermal Issues in DRAM
SRAM Memory Architecture
Why do we need Sense amplifiers and Precharge Circuit?
Nanosheet FET
Why there is a pinch-off during the saturation mode of a CMOS device?
CMOS Interview Questions
Temperature Inversion on Lower Nodes

Related Posts

Analog and Memory Layout Design Forum
Physical Layout Design Forum
RTL & Verilog Design Forum
Semiconductor Forum
Analog Layout Design Interview Questions Verilog Interview Questions
Physical Design Interview Questions STA Interview Questions
Digital Design Interview Questions
50+ Top Memory Layout Multiple Choice Questions with Answers
50+ Top Analog Layout Multiple Choice Questions with Answers
50+ Top Verilog Design Multiple Choice Questions with Answers
50+ Top Physical Design Multiple Choice Questions with Answers
50+ Top ASIC Flow Multiple Choice Questions with Answers
50+ Top Digital Design Multiple Choice Questions with Answers
50+ Top Combinational Circuits Multiple Choice Questions with Answers
50+ Top Logic Families Multiple Choice Questions with Answers   #
50+ Top VLSI Design Multiple Choice Questions with Answers

 

 

Memory Circuit Design

 

Share.

Related Posts

87 Comments

  1. Pingback: Why SRAM is faster than DRAM | siliconvlsi

  2. Pingback: SRAM Memory Architecture | siliconvlsi

  3. Pingback: Why we need Sense amplifiers and Precharge Circuit? | siliconvlsi

  4. Pingback: Nanosheet FET | siliconvlsi

  5. Pingback: Why there is a pinch-off during saturation mode of a CMOS device? | siliconvlsi

  6. Pingback: Isolation cells & Level Shifter cells | siliconvlsi

  7. Pingback: Different Types of IC Packaging | siliconvlsi

  8. Pingback: What is Threshold voltage? | siliconvlsi

  9. Pingback: What is odd cycle error in vlsi | siliconvlsi

  10. Pingback: Significance of CRPR in Static Timing Analysis | siliconvlsi

  11. Pingback: What are the effects of Metastability | siliconvlsi

  12. Pingback: What is PIN Diode?  | siliconvlsi

  13. Pingback: IoT (Internet of Things) devices | siliconvlsi

  14. Pingback: On chip Variation (OCV) | siliconvlsi

  15. Pingback: Schematic & Layout Design | siliconvlsi

  16. Pingback: Characteristics of Operational Amplifier | siliconvlsi

  17. Pingback: Doping in VLSI | siliconvlsi

  18. Pingback: What do you mean by clock Jitter? | siliconvlsi

  19. Pingback: Why is Timing Analysis important in Physical Design? | siliconvlsi

  20. Pingback: What is pinch off effect in mosfet | siliconvlsi

  21. Pingback: linux interview questions | siliconvlsi

  22. Pingback: Why does 32-bit called x86 while 64-bit called x64 | siliconvlsi

  23. Pingback: Drain Induced Barrier owering (DIBL) effect | siliconvlsi

  24. Pingback: Frequency modulation (FM) | siliconvlsi

  25. Pingback: 30 Linux Basic Commands Every User Should Know | siliconvlsi

  26. Pingback: How many Vias you will use and how it will help to reduce resistance | siliconvlsi

  27. Pingback: What are the ways to reduce Metal Resistance? | siliconvlsi

  28. Pingback: Difference between Analog and Digital layout | siliconvlsi

  29. Pingback: Why is Polysilicon(Poly gate) used as a gate contact instead of metal in CMOS? | siliconvlsi

  30. Pingback: Floorplanning | siliconvlsi

  31. Pingback: SRAM vs DRAM | siliconvlsi

  32. Pingback: Use of Dummy devices in Analog Layout | siliconvlsi

  33. Pingback: Shielding to reduce noise - Analog Layout | siliconvlsi

  34. Pingback: Triple-Well Processes | siliconvlsi

  35. Pingback: What do you mean by clock skew? | siliconvlsi

  36. Pingback: Channel Length Modulation | siliconvlsi

  37. Pingback: Semiconductor | siliconvlsi

  38. Pingback: How you will take care of power in standard cells? | siliconvlsi

  39. Pingback: What is IR drop | siliconvlsi

  40. Pingback: Why their is always contact(via0) in between diffusion or poly and metal ? why not via1,via2,via3 ? | siliconvlsi

  41. Pingback: Why we extend poly over the diffusion? | siliconvlsi

  42. Pingback: CMOS Delay Cell | siliconvlsi

  43. Pingback: What are the steps involved in Semiconductor device Fabrication? | siliconvlsi

  44. Pingback: Difference between the TTL chips and CMOS chips? | siliconvlsi

  45. Pingback: List of Sanity Checks in Physical Design | siliconvlsi

  46. Pingback: Difference between statistical and conventional STA | siliconvlsi

  47. Pingback: iot devices meaning | siliconvlsi

  48. Pingback: Difference Between FinFET and MOSFET | siliconvlsi

  49. Pingback: Chemical Vapor Deposition | siliconvlsi

  50. Pingback: What are DRC & how will you fix them? | siliconvlsi

  51. Pingback: Fin Field-Effect Transistor | siliconvlsi

  52. Pingback: MOSFET Scaling | siliconvlsi

  53. Pingback: Binary numbers | siliconvlsi

  54. Pingback: Voltage Divider Formula | siliconvlsi

  55. Pingback: Why NMOS pass strong 0 and weak 1 | siliconvlsi

  56. Pingback: Why timing analysis is an Important Factor? | siliconvlsi

  57. Pingback: Why PMOS pass strong 1 and weak 0 | siliconvlsi

  58. Pingback: DSM Effects in vlsi | siliconvlsi

  59. Pingback: What is aging effect in vlsi | siliconvlsi

  60. Pingback: Decap Cell and Bypass Capacitor | siliconvlsi

  61. Pingback: What are the Limitations of Hadoop 1.0 | siliconvlsi

  62. Pingback: Thermal Issues in DRAM | siliconvlsi

  63. Pingback: Well Proximity Effect | siliconvlsi

  64. Pingback: Analog Layout Design-Improve Parasitic Capacitance in IC layouts | siliconvlsi

  65. Pingback: CLB (Configurable Logic Blocks) | siliconvlsi

  66. Pingback: What is Wells, Taps, and Guard rings in Analog Layout design | siliconvlsi

  67. Pingback: Layout Design Rule - Stick Diagrams | siliconvlsi Analog Design

  68. Pingback: D flip flop using mux | siliconvlsi

  69. Pingback: VLSI Interview Questions | siliconvlsi

  70. Pingback: What is surface scattering in MOSFET? | siliconvlsi

  71. Pingback: Physical Design Interview Questions | siliconvlsi

  72. Pingback: NAND Gate- Symbol, Truth Table, Circuit Diagram | siliconvlsi

  73. Pingback: Explain the Various Types of Input and Output Verbs | siliconvlsi

  74. Pingback: OR Gate-Symbol, Truth Table, and Circuit Diagram | siliconvlsi

  75. Pingback: AND Gate: Symbol, Truth Table, Working, Circuit Diagram | siliconvlsi

  76. Pingback: Differences between FD-SOI and FinFET | siliconvlsi

  77. Pingback: Why do Digital circuits use less power than Analog Circuit | siliconvlsi

  78. Pingback: Second Order Effects in cmos | siliconvlsi

  79. Pingback: Toggle or T flip-flop | siliconvlsi

  80. Pingback: TDDB(Time-Dependent Dielectric Breakdown) | siliconvlsi

  81. Pingback: Impact ionization | siliconvlsi

  82. Pingback: What is Verilog? | siliconvlsi

  83. Pingback: Guard-ring : Analog Layout | siliconvlsi

  84. Pingback: What are Resistance Capacitance and Inductance? | siliconvlsi

  85. Pingback: i/p’s and o/p’s of power planning and placement | siliconvlsi

  86. Pingback: 2:1 MUX Using NAND | siliconvlsi

  87. Pingback: SAP Labs Interview Questions | siliconvlsi

Leave A Reply

error: Content is protected !!