Electromigration (EM) and IR-Drop (Voltage Drop) can impact how well-integrated circuits in electronic devices work. Let’s explore each issue and talk about how to prevent them:
Electromigration (EM)
Electromigration happens when electrons make atoms in a conductor (usually metal connections in circuits) move. Over time, this movement can create empty spaces or gaps in the conductor, causing the circuit to break down.
How to Prevent Electromigration (EM)?
Material Selection: Pick materials that resist electromigration. Copper is often chosen over aluminum for connections because it stands up better to electromigration.
Increasing Line Width: Making metal lines wider helps lower the density of electrical current, reducing the effects of electromigration.
Stress Engineering: Use techniques like stress liner deposition to change the stress in metal lines, influencing their resistance to electromigration.
IR-Drop (Voltage Drop)
IR-Drop, or voltage drop, is the loss of voltage that happens across the resistance of conductive materials in a circuit, especially in power distribution networks. Too much voltage drop can lower the operating voltage at the load, impacting the circuit’s performance.
How to Prevent IR-Drop (Voltage Drop)?
Optimizing Power Grid Design: Create an effective power grid with the right wire widths, thicknesses, and distribution to minimize IR-Drop.
Voltage Regulation: Use voltage regulators and power management techniques to keep a consistent voltage level and reduce the impact of voltage drops.
Low-Resistance Materials: Choose materials with lower resistivity for power distribution lines to decrease IR-Drop.
In both cases, careful design and material choices are essential. Integrated circuit designers and semiconductor manufacturers use different methods and tools to model, analyze, and solve problems related to electromigration and voltage drop, making sure electronic devices are reliable and perform well.