Silicon (Si) serves as the foundational material for the majority of chips. The popularity of silicon stems from its numerous…
Author: siliconvlsi
Fundamentals of IC Fabrication The semiconductor material utilized in creating integrated circuits (ICs) is prepared in the form of thin,…
Multi-Layer Printed Circuit Boards Boards can be created by stacking multiple layers of substrate cores, resulting in what’s known as…
Complementation Process in DFA The complementation process in deterministic finite automata (DFA) is explained as follows: Consider a DFA defined…
Concatenation Process in DFA The concatenation process in deterministic finite automata (DFA) is explained as follows: If there are two…
Explain the concept of on-chip Electrostatic Discharge (ESD) protection Electrostatic discharge (ESD) poses a serious threat to the reliability and…
Impedance Matching Impedance matching is a important concept in electronics that involves designing source and load impedances to minimize signal…
First-In-First-Out Buffer (FIFO Buffer) – Simplified Explanation FIFO stands for “First In First Out,” which simply means that the data…
Last-In-First-Out Buffer (LIFO Buffer) – Simplified Explanation In low-level programming, we deal with data stored in small memory units called…
D Flip-Flop The output of a D Flip-Flop tracks the input, making transitions that match those of the input. The…