CIF (Caltech Intermediate Form) and GDSII (GDS) stream formats are standard layout description languages used to transfer mask-level layouts between organizations(fab)…
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The antenna Effect in VLSI is also called plasma-induced gate oxide damage, which occurs during the fabrication process. AntennaEffect may…
Following is the input for Physical design. Basic ASIC flow Basic Verilog concepts Understanding of the synthesis process Scripting languages…
Skew refers to the difference in arrival times of signals at different points in a circuit. It is the delay…
Dielectric erosion and Cu dishing after Cu CMP Chemical mechanical polishing (CMP) is a powerful fabrication technique that uses chemical oxidation…
IC Packaging types – An Advanced PCB Design The term “IC packaging” describes the substance that holds a semiconductor device.…
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuit (IC) “chips”. Steps involved in semiconductor…
Feedback is a process whereby some proportion of the output signal of a system is passed (fed back) to the…
Fixing Double-patterning Errors in FinFET(2024) The so-called odd-cycle path is the most typical double patterning error. This occurs when an…
Blockages and Halos – VLSI Basics Blockages and Halo: The limits of photolithography, the method used to pattern a circuit…