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Home»VLSI Design»What are the steps involved in Semiconductor device Fabrication?
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What are the steps involved in Semiconductor device Fabrication?

siliconvlsiBy siliconvlsiFebruary 11, 2023Updated:December 29, 2024No Comments1 Min Read
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How Are Semiconductors Made? A Complete Guide to Fabrication Steps

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuit (IC) “chips”.

Circuit Fabrication
Circuit Fabrication

Steps involved in semiconductor device fabrication

Wafer processing
Wet cleans
Photolithography
Ion implantation
Dry etching
Wet etching
Plasma ashing
Thermal treatments
Rapid thermal anneal
Furnace annealsThermal oxidation
Chemical vapor deposition (CVD)
Physical vapor deposition (PVD)
Molecular beam epitaxy (MBE)
Electrochemical Deposition (ECD). See Electroplating
Chemical-mechanical planarization (CMP)
Wafer testing
Wafer back grinding
Die preparation
Wafer mounting
Die-cutting
IC packaging
Die attachment
IC Bonding
Wire bonding
Flip chip
Tab bonding
IC encapsulation
Baking
Plating
Laser marking
Trim and form
IC testing

VLSI Fabrication Step
VLSI Fabrication Step
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