Close Menu
  • Analog Design
    • Latest Analog Layout Interview Questions (2025)
  • Digital Design
    • Digital Electronics Interview Question(2025)
    • Top VLSI Interview Questions
  • Physical Design
    • Physical Design Interview Questions for VLSI Engineers
  • Verilog
    • Verilog Interview Questions(2024)
  • Forum
Facebook Instagram YouTube LinkedIn WhatsApp
SiliconvlsiSiliconvlsi
Forum Questions Register in Forum Login in Forum
Facebook Instagram YouTube LinkedIn WhatsApp
  • Analog Design
    • Latest Analog Layout Interview Questions (2025)
  • Digital Design
    • Digital Electronics Interview Question(2025)
    • Top VLSI Interview Questions
  • Physical Design
    • Physical Design Interview Questions for VLSI Engineers
  • Verilog
    • Verilog Interview Questions(2024)
  • Forum
SiliconvlsiSiliconvlsi
Home»Digital Design»On chip Variation (OCV)
Digital Design

On chip Variation (OCV)

siliconvlsiBy siliconvlsiDecember 17, 2022Updated:May 12, 2024No Comments1 Min Read
Facebook Pinterest LinkedIn Email WhatsApp
Share
Facebook Twitter LinkedIn Pinterest Email

On-chip variation (OCV) is a recognition of the intrinsic variability of semiconductor processes and their impact on factors such as logic timing. It comes due to some variations at the manufacturing level, the speed is not uniform throughout the chip. There is variation in the effective channel length and width of transistors. Due to complexities and variations in submicron technologies, the devices with the same size may have different widths as compared to the idle condition.

A list of on-chip variations

  • Static Timings Analysis.
  • Variation in temperature.
  • Variation in interconnects.
  • Variation in transistor width.
  • Variation in threshold voltage.
  • Variation in the channel length.

Sources of on-chip variation (OCV)

  • Etching  #
  • Photolithography
  • Chemical mechanical planarization

Types of Variation in VLSI

  • Process Variations
    • Global Variations  #
    • Local Variations
  • Voltage Variations
  • Temperature Variations
  • Aging Effect
    • Hot Carrier Injection (HCI)
    • Bias Temperature Instability (BTI)
    • Electromigration
    • NBTI
    • TDDB

Global on-chip variation

If the performance difference comes between the die-to-die, is known as global on-chip variation. It is modeled as operating corners. #

Local on-chip variation

If the performance difference comes between within the same die, is known as Local on-chip variation.

Share. Facebook Twitter Pinterest LinkedIn Tumblr Email

Related Posts

Understanding the Difference Between RAM Bandwidth and Clock Speed

December 1, 2024

Why is Frequency Planning so important in Module Design?

September 2, 2024

How Are Electrostatic Discharge (ESD) Protection and Latch-Up Related to Each Other?

July 20, 2024
Leave A Reply Cancel Reply

Facebook X (Twitter) Instagram Pinterest Vimeo YouTube
  • About Us
  • Contact Us
  • Privacy Policy
© 2025 Siliconvlsi.

Type above and press Enter to search. Press Esc to cancel.