Semiconductor Chip Packaging
In electronics, packaging like this acts as a protective enclosure, shielding the IC block and helping us make electrical connections that transmit signals to the circuit board of electronic devices.
Differences between chip packaging and chip fabrication
Here’s the information presented in a table format:
| Aspect | Chip Fabrication | Chip Packaging |
|---|---|---|
| Definition | Process of creating semiconductor devices on wafers | Assembly of fabricated chips into protective packages |
| Purpose | Creation of semiconductor devices | Enclosure and connection of chips |
| Processes | Photolithography, deposition, etching, doping | Die attachment, wire bonding, encapsulation, testing |
| Scale | Nanometer-scale | Millimeter to centimeter scale |
| Complexity | Highly complex | Moderately complex |
| Customization | Allows customization of semiconductor devices | Limited customization of packages |
This table provides a concise comparison between chip fabrication and chip packaging, highlighting their differences in various aspects.