Differences between chip packaging and chip fabrication
Here’s the information presented in a table format:
Aspect | Chip Fabrication | Chip Packaging |
---|---|---|
Definition | Process of creating semiconductor devices on wafers | Assembly of fabricated chips into protective packages |
Purpose | Creation of semiconductor devices | Enclosure and connection of chips |
Processes | Photolithography, deposition, etching, doping | Die attachment, wire bonding, encapsulation, testing |
Scale | Nanometer-scale | Millimeter to centimeter scale |
Complexity | Highly complex | Moderately complex |
Customization | Allows customization of semiconductor devices | Limited customization of packages |
This table provides a concise comparison between chip fabrication and chip packaging, highlighting their differences in various aspects.