If you're working on a standard cell layout, you definitely want to include tap cells strategically. Without them, you risk creating isolated p-well or n-well regions, which can lead to potential latch-up under transient conditions. When you insert tap cells at proper intervals, you’re essentially providing a low-resistance path to ground or power, which prevents parasitic thyristor structures from turning on. You’ll also find that EDA tools usually have options to automate this, making your job easier and your layout more robust.
We usually follow the foundry guidelines for tap cell insertion during our digital place-and-route. By spacing tap cells correctly—typically every 20 to 30 microns—we maintain a strong connection to VDD and VSS, which helps clamp the substrate and well potentials. This significantly reduces the chances of parasitic SCR triggering. In our team’s standard flow, we automate this during floorplanning, and we’ve rarely seen latch-up related issues in silicon. So yes, tap cells really do make a difference when used correctly.
I’ve seen tap cells work really well in mitigating latch-up issues, especially in deep sub-micron nodes. In one of my previous designs, we initially skipped adding tap cells uniformly and ended up debugging a painful latch-up scenario during silicon bring-up. After we introduced tap cells at regular intervals, the substrate potential was much more controlled and stable. From my experience, ensuring proper tap cell insertion during PNR is one of the key strategies to reduce latch-up risk effectively.
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