Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuit (IC) “chips”.
Steps involved in semiconductor device fabrication
Wafer processing
Wet cleans
Photolithography
Ion implantation
Dry etching
Wet etching
Plasma ashing
Thermal treatments
Rapid thermal anneal
Furnace annealsThermal oxidation
Chemical vapor deposition (CVD)
Physical vapor deposition (PVD)
Molecular beam epitaxy (MBE)
Electrochemical Deposition (ECD). See Electroplating
Chemical-mechanical planarization (CMP)
Wafer testing
Wafer back grinding
Die preparation
Wafer mounting
Die-cutting
IC packaging
Die attachment
IC Bonding
Wire bonding
Flip chip
Tab bonding
IC encapsulation
Baking
Plating
Laser marking
Trim and form
IC testing
