What is EUV lithography? When we use Extreme Ultraviolet Lithography (EUVL), we’re working with an advanced technology that uses a…
Author: siliconvlsi
Choosing the Number of Metallization Layers in Semiconductor Processes The decision on the number of metallization layers in state-of-the-art semiconductor…
Metal-Semiconductor Ohmic Contact When you look at the interface between a semiconductor and metal, you’ll notice a region where charge…
The Damascene Technique for Finely Structured Metallization Layers The Damascene technique is used in the back-end-of-line (BEOL) for the final…
Back-End-of-Line (BEOL) Layer In modern semiconductor chips, the implementation of complex circuits requires multiple metallization layers. While the Front-End-of-Line (FEOL)…
Wet Etching and Dry Etching In semiconductor manufacturing, I see that etching is important for shaping and defining different structures…
Thermal Oxidation Thermal oxidation is key in creating an oxide layer on the silicon wafer surface. As this oxide layer…
Optical Proximity Correction (OPC) I want to share how Optical Proximity Correction (OPC) plays a crucial role in improving the…
Public modifiers In Java, there are two access modifiers that we can use for classes: “public” and “default” (also known…
There are three types of access modifiers in Java. public, private, protected. If no access modifier is specified then it…