Complementary Metal Oxide Semiconductor (CMOS) Complementary Metal Oxide Semiconductor (CMOS) stands for the term used in the computer chip design…
Browsing: Digital Design
Steps Involved in Small-Signal Analysis of MOSFET When we talk about small signal MOSFETs, we’re referring to a portfolio that…
Intermetal Low-k Dielectrics Intermetal low-k dielectrics, you’ll see that they’re closely linked to the properties of the low-k material. Compared…
Choosing the Number of Metallization Layers in Semiconductor Processes The decision on the number of metallization layers in state-of-the-art semiconductor…
Back-End-of-Line (BEOL) Layer In modern semiconductor chips, the implementation of complex circuits requires multiple metallization layers. While the Front-End-of-Line (FEOL)…
Optical Proximity Correction (OPC) Optical Proximity Correction (OPC) plays an important role in improving the accuracy of pattern transfer during…
Subthreshold Leakage Subthreshold conduction in CMOS transistors is the small leakage current that still flows between the source and drain…
FinFET technology, short for “Fin Field-Effect Transistor,” has several advantages over the traditional planar CMOS technology Here are five Advantage…
In SRAM (Static Random Access Memory), a column decoder and a multiplexer (mux) are important parts that help the memory…
The Octal Number System uses only eight digits: 0, 1, 2, 3, 4, 5, 6, and 7, with a base…