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  • Analog Design
    • Latest Analog Layout Interview Questions (2025)
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    • Physical Design Interview Questions for VLSI Engineers
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Verilog

Difference Between Mealy and Moore Machine

By siliconvlsiJuly 22, 20230

Mealy vs Moore machine The main difference between Mealy and Moore machines lies in how you get the output. In…

Verilog

Finite State Machine Meaning and Working

By siliconvlsiJuly 22, 20230

Finite State Machines (FSMs) Definition When we work on any sequential function in a system, finite state machines (FSMs) become…

VLSI Design

What is a Reverse Breakdown in VLSI?

By siliconvlsiJuly 22, 20230

Reverse Breakdown Characteristic What is a Reverse Breakdown in VLSI? When you apply reverse bias to a pn junction, it…

Electrical Design

Voltage Drop in AC Circuits

By siliconvlsiJuly 22, 20230

Understanding Voltage Drop in AC Circuits: A Student’s Guide Voltage drop is the reduction in electrical potential in a circuit’s…

Electrical Design

How is voltage drop related to resistance?

By siliconvlsiJuly 22, 20230

Understanding Voltage Drop in DC Circuits In a direct-current (DC) circuit, the concept of voltage drop is crucial for understanding…

Electrical Design

Understanding Voltage Drop in Electrical Circuits

By siliconvlsiJuly 22, 20230

What is Voltage Drop? When you talk about voltage drop, you’re referring to the reduction in electrical potential that happens…

VLSI Design

What is Dangling Bond?

By siliconvlsiJuly 22, 20230

What is Dangling Bond? A dangling bond occurs when an immobilized atom has an unsatisfied valence. Atoms typically strive to…

VLSI Design

What are Schottky Barrier Diodes (SBD)?

By siliconvlsiJuly 22, 20230

What are Schottky Barrier Diodes (SBD)? Schottky barrier diodes (SBDs) are a special kind of diode that you and I…

VLSI Design

Influence of Porosity on TDDB Lifetime of Low-k Dielectrics

By siliconvlsiJuly 22, 20230

Influence of Porosity on TDDB Lifetime of Low-k Dielectrics When you increase the porosity of intrinsic low-k dielectrics, the Time-Dependent…

VLSI Design

Stress-Induced Voiding in Interconnects

By siliconvlsiJuly 22, 20230

Understanding Stress-Induced Voiding in Metal Conductors Stress-induced voiding (SIV), or stress migration, happens when metal conductor ions move due to…

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