Understanding Piezoelectric Materials Piezoelectric materials get their name from the term “piezo,” which means pressure or stress. Piezoelectricity is the…
Intermetal Low-k Dielectrics Intermetal low-k dielectrics, you’ll see that they’re closely linked to the properties of the low-k material. Compared…
Electron-Beam Lithography (EBL) Electron beam lithography (EBL) is a powerful direct-write method that you and I can use when we…
What is EUV lithography? Extreme Ultraviolet Lithography (EUVL), we’re working with an advanced technology that uses a light source with…
Choosing the Number of Metallization Layers in Semiconductor Processes The decision on the number of metallization layers in state-of-the-art semiconductor…
Metal-Semiconductor Ohmic Contact When you look at the interface between a semiconductor and metal, you’ll notice a region where charge…
The Damascene Technique for Finely Structured Metallization Layers Damascene technique is used in the back-end-of-line (BEOL) for the final planarization…
Back-End-of-Line (BEOL) Layer In modern semiconductor chips, the implementation of complex circuits requires multiple metallization layers. While the Front-End-of-Line (FEOL)…
Wet Etching and Dry Etching In semiconductor manufacturing, I see that etching is important for shaping and defining different structures…
Thermal Oxidation Thermal oxidation is key in creating an oxide layer on the silicon wafer surface. As this oxide layer…