Understanding Piezoelectric Materials Piezoelectric materials get their name from the term “piezo,” which means pressure or stress. Piezoelectricity is the…
Author: siliconvlsi
Intermetal Low-k Dielectrics When we look at the process integration and reliability of intermetal low-k dielectrics, you’ll see that they’re…
Electron-Beam Lithography (EBL) When you use electron-beam lithography (EBL), you’ll be scanning a focused beam of electrons to create custom…
What is EUV lithography? When we use Extreme Ultraviolet Lithography (EUVL), we’re working with an advanced technology that uses a…
Choosing the Number of Metallization Layers in Semiconductor Processes The decision on the number of metallization layers in state-of-the-art semiconductor…
Metal-Semiconductor Ohmic Contact When you look at the interface between a semiconductor and metal, you’ll notice a region where charge…
The Damascene Technique for Finely Structured Metallization Layers The Damascene technique is used in the back-end-of-line (BEOL) for the final…
Back-End-of-Line (BEOL) Layer In modern semiconductor chips, the implementation of complex circuits requires multiple metallization layers. While the Front-End-of-Line (FEOL)…
Wet Etching and Dry Etching In semiconductor manufacturing, I see that etching is important for shaping and defining different structures…
Thermal Oxidation Thermal oxidation is key in creating an oxide layer on the silicon wafer surface. As this oxide layer…